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subject ¢Âµ¿°æ Àμâȸ·Î±âÆÇ ¹Ú¶÷ȸ/JPCA SHOW 2005 Âü°ü´Ü ¸ðÁý.. date 2005-05-04
writer (ÁÖ)ÄÉÀ̸޼¼ read 1920
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¡¼ µ¿°æ Àμâȸ·Î±âÆÇ ¹Ú¶÷ȸ/JPCA SHOW 2005 ¡½
°³ÃÖÀÏÀÚ : 2005³â 6¿ù 1ÀÏ - 6¿ù 3ÀÏ
°³ÃÖÀå¼Ò : TOkyo Big Sight (µ¿°æ ºò »çÀÌÆ® Àü½ÃÀå)
Àü½ÃÇ°¸ñ : ¢ºPWB TECHNOLOGY EXPO 2005
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¢ºFPC(FLEXIBLE CIRCUITS) EXPO 2005
Ç÷º½Ãºí ÀüÀÚ±âÆÇ, ´ÙÃþÇ÷º½Ãºí ÀüÀÚ±âÆÇ, TAB/COF/TCP, Å×ÀÌÇÁ, Çʸ§°è ÀüÀÚȸ·Î Àü¹Ý, FPC ÀÀ¿ëÁ¦Ç°(Æò¸éÆгΠµð½ºÇ÷¹ÀÌ ¸ðµâ/Ç¥½Ãµð¹ÙÀ̽º, µå¶óÀ̺ê¸ðµâ µî), Ç÷º½Ãºí ÀüÀÚ±âÆÇ, TAB,COF,Çø§°è ÀüÀÚȸ·Î Á¦Á¶/°¡°ø±â¼ú¿¡ ÇÊ¿äÇÑ °¢Á¾Àç·á, °ü·ÃºÎÀÚÀç ¹× ±â°èÀåÄ¡, ¿ÀÅäÄ¿ÅÍ, ÇÉĪÀåÄ¡, Àü¿ë±ÝÇü/°¡°ø±â¼ú, °øÀå¼³ºñ, °ü·Ã¼­Àû
¢ºDES(Design and mfg.Engineering Solutions)Expo
ÀÀ¿ëÇÁ·Î±×·¥, ÀüÀÚȸ·Î¼³°è, ½Ã½ºÅÛ ÄÁ¼³Å×ÀÌ¼Ç ¼­ºñ½º, EMS/ODM,Åë½Å, ³×Æ®¿÷Å©, ÀÎÅÍ³Ý ¸ÖƼ¹Ìµð¾î °ü·Ã °¢Á¾ ½Ã½ºÅÛ ¼Ö·ç¼Ç, CAD/CAM/CIM µî CAE Áö¿øÀåÄ¡, Á¦Ç°, »óÇ°µðÀÚÀÎ ±â¼ú, ÄÉÀ̽º¼³°è, ¸ðµ¨½ÃÀÛ, ±ÝÇü, ¼ºÇü, °¢Á¾RP(·¡ÇÇÆ® ÇÁ·ÎŸÀÌÇÎ)Áö¿øÀåÄ¡ ¹× ½Ã½ºÅÛ °ü·Ã ¼­Àû
¢ºMicroTEST(Testing/Inspection and Analysis Exhibition)
°¢Á¾ ¿Ü°ü°Ë»çÀåÄ¡, X ¼± °Ë»çÀåÄ¡, Æò°¡/½ÃÇè±â, °¢Á¾Å×½ºÅÍ, ÀåÄ¡¿ëºÎÇ°, 3Â÷¿øÃøÁ¤±â±â/2Â÷¿øÃøÁ¤±â±â, °¢Á¾ ÃøÁ¤ÀåÄ¡, °¢Á¾ºÐ¼®±â±â, ºÐ¼®, Çؼ®, Æò°¡, ¼öŹ¼­ºñ½º, È­»ó󸮱â±â, È­»ó°èÃøÀåÄ¡, °¡»óÇö½Ç(VR) °ü·ÃÀåÄ¡ ¹× ±â¼ú, °ü·Ã¼­Àû
¢º2005 Microelectronics Show (19th ADVANCED ELECTRONICS PACKAGING EXHIBITION)
°í¹Ðµµ °í¼Ó °íÁÖÆÄ ½ÇÀå±â¼ú ÀÀ¿ë±â±â, °í¹Ðµµ, ¼­ºê½ºÆ®·¹ÀÌÆ®, ÀÎÅÍÆ÷Àú ¹× ±âÀç, ¹ÝµµÃ¼ ÆÐÅ°ÁöÁ¦Ç°, ¼ÒÇüÀüÀÚºÎÇ°, ½ÇÀå µð¹ÙÀ̽º, ±¤ °ü·ÃºÎÇ°, ÀÓº£µðµå ½Ã½ºÅÛ, ³³¶«, Á¢ÇÕ, Á¢¼ÓÀç·á µî °í¹Ðµµ ½ÇÀå°ü·ÃÀç·á, º»´õ, ¸¶¿îÅÍ, µð½ºÆÒ¼­, ÀμâÁö µî °¢Á¾ ½ÇÀå°ü·Ã ±â°è ¹× ÀåÄ¡, ¿¡ÄÚ·ÎÁö µðÀÚÀνýºÅÛ, »ý»ê°øÀå¼³ºñ, °ü·Ã¼­Àû




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